Recent breakthroughs in AI have not only increased demand for AI products, they've also lowered the barriers to entry for those who want to build AI products. Everyone, including those with minimal or no prior AI experience, can now leverage AI models to build applications.
Recent breakthroughs in AI have not only increased demand for AI products, they've also lowered the barriers to entry for those who want to build AI products. Everyone, including those with minimal or no prior AI experience, can now leverage AI models to build applications.
Recent breakthroughs in AI have not only increased demand for AI products, they've also lowered the barriers to entry for those who want to build AI products. Everyone, including those with minimal or no prior AI experience, can now leverage AI models to build applications.
Recent breakthroughs in AI have not only increased demand for AI products, they've also lowered the barriers to entry for those who want to build AI products. Everyone, including those with minimal or no prior AI experience, can now leverage AI models to build applications.
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What stands out about this textbook is the clear chapter objectives listed upfront.
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Author: Huyen, Chip Chip Huyen, ISBN 10: 1098166302. Title: AI Engineering: Building Applications with Foundation Models Item Condition: New. Book Details. Will be clean, not soiled or stained.
The product is an AI engineering textbook titled "Building Applications with Foundation Models" by Chip Huyen. Published by O'Reilly Media, Incorporated in 2024, this trade paperback book is geared towards adult and further education levels in the subject area of computer science. With a focus on models and practical applications, this publication is designed to help readers understand and implement AI engineering concepts in a clear and organized manner. It provides valuable insights and guidance for those looking to enhance their knowledge and skills in the field of artificial intelligence.
Publication Date: 2025-04-01. Number of Pages: 350. ISBN10: 1098166302.
